Making the high adhesion between the aluminum and the resin, and the improvement of the heat dissipation the heat sink
Kanto Gakuin University Surface Engineering Research Institute Co., Ltd. development cooperation
As the heat to be emitted from the electronic device and the lighting apparatus has bad influence on security and performance of the machinery, the anti-heat measure becomes the big problem.
The aluminum is used as the cooling devise as it is light and is superior in the heat conduction, but the further improvement of the heat dissipation is demanded. In addition, the improvement of the adhesive strength between the insulating resin and the aluminum becomes the problem when it is used for a printed circuit board.
On the other hand, in the automobile industry,the policy of decreasing the radiated heat from the various electrical parts and the driving-force components in the development of the hybrid and the electric car as the key to the environmental problems is truly demanded. The aluminum component is used as the cooling device and the further improvement of the heat dissipation is demanded. Also, from a point of view of lightening, the switchover from the steel sheets to the aluminum, the resin, the composite parts of the aluminum or the resin, and so on is made. And furthermore,the firm adhesion between the aluminum and the resin is sought after.
Because the surface of aluminum is roughened to a subtle degree by this technology, which makes surface area become wider more than 100 times in comparison with the unprocessed surface,
- it is possible to expect the improvement of the adhesive strength between aluminum and the resin.
(adhesive power becomes 10 times stronger by the existing processing ratio) - it is possible to expect the improvement of the heat dissipation about the aluminum cooling device.
(the effect on improvement of the heat dissipation of more than 10% in the comparison with the unprocessed situation)
 Result of improvement of the adhesive strength with the various resin |
 Result of improvement of heat dissipation |
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 Printed wiring board with the aluminum cooling wheel |
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 Surface treatment to the heat sink |
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